Samsung aims to sell 320 million smartphones this year
Published in Mobiles


Wants to keep its lead

According to a fresh report, Samsung aims to sell a total of 320 million smartphones in 2018.

Intel knocked off number one chip slot
Published in News


Samsung beats Chipzilla up

Figures just in from the Gartner Group showed that Samsung was the leader in chip sales in 2017.

TSMC might outpace Samsung on 7nm
Published in PC Hardware


Secured orders from 40 big customers


TSMC is set to take Samsung to the cleaners this year in the race to 7nm process volume production.

TSMC gears up to take Qualcomm business from Samsung next year
Published in PC Hardware


Samsung can’t churn out 7nm chips in 2018

TSMC will nick some of Qualcomm modem chip and core processor orders from its biggest rival Samsung Electronics next year.

Samsung shopping for parts for new Galaxy S9 series
Published in Mobiles


Off to suppliers with its shopping trolley

Word on the street is that buyers for Samsung have been seen pushing a shopping trolley between vendors as they gather parts for the next Galaxy S9 series.

Huawei's Honor takes aim at youth market
Published in News


Trick cyclists ahoy

Honor - Huawei's mobile phone company - held a massive event in the City of London yesterday and vowed to take on giants Samsung and Apple and beat them at their own game.

Qualcomm announces Snapdragon 845
Published in Mobiles


SVP Alex Katouzian shows the chip

Qualcomm has just wrapped up the second Snapdragon technology event keynote and a small part of the keynote was the three year effort called the Snapdragon 845.

Samsung finds another use for graphene balls
Published in News


li-ion with great balls of fire

Samsung’s Advanced Institute of Technology has come up with another use for graphene balls – giving a coat for use inside a regular li-ion cell.

Samsung starts 2nd-gen 10nm FinFET mass production
Published in News


Switching from 10nm LPE to 10nm LPP

Samsung has announced that it has geared up into mass production of its 2nd generation 10nm FinFET manufacturing process technology, moving from 10nm LPE (Low Power Early) to 10nm LPP (Low Power Plus).

Samsung sticks with heat pipes
Published in News


A baggepype wel coude he blowe and sowne, And ther-with-al he broghte us out of towne.


Despite rumours, it looks like Samsung Electronics is going to keep using heat pipes in its designs.